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    HomePCB PortfolioInsulated Metal Base PCBs

    Insulated Metal Base PCBs

    New opportunities with insulated metal substrate

    For greater amounts of energy or local thermal loads, e.g in modern constructions with high intensity LEDS, IMS technology can be used. The abbreviation, IMS, stands for “Insulated Metal Substrate.” This is a PCB built on a metal plate – normally aluminium – on which a special prepreg is applied, the primary qualities of which are an excellent capacity for heat dissipation and great dielectric strength against high voltages. 

     

    The advantages of IMS PCBs for heat dissipation

    An IMS PCB can be designed with a very low thermal resistance. If, for example, you compare a 1.60 mm FR4 PCB to an IMS PCB with a 0.15 mm thermal prepreg, you may well find the thermal resistance is more than 100 times that of the FR4 PCB. In standard FR4 products, it is very difficult to dissipate a large amount of heat away from components.

    FeatureTechnical Specification
    Number of Layers1-4 layers
    Technology HighlightsEffective heat sink solutions for thermal applications. This construction type enables superior heat dissipation through use of either aluminium or copper substrate bonded to the insulated circuitry through thermal pre-preg or resin systems.
    MaterialsAluminium & copper plates, FR-4, PTFE, thermal dielectrics
    Dielectric Thickness0.05mm - 0.20mm
    Thermal Conductivity1-12 W/m/K
    Profile MethodPunching, Liquid cooled routing
    Copper Weights (Finished)35μm - 140μm
    Minimum Track and Gaps0.10mm / 0.10mm
    Metal Core Thickness0.40mm – 3.20mm
    Maximum Dimensions550mm x 700mm
    Surface Finishes AvailableHASL, LF HASL, OSP, ENIG, Immersion Tin, Immersion Silver
    Minimum Mechanical Drill0.30mm
    Minimum Laser Drill0.10mm standard, 0.075mm advanced

    Insulated Metal Substrate PCBs: Thermal Boards for High-Power, High-Reliability Systems

    Insulated Metal Substrate PCBs—also called IMS PCBs or Metal Core PCBs—are built for electronics where heat density is the main design limit. Instead of a fiberglass core, IMS boards use a metal Substrate (aluminum or copper) bonded to a thermally conductive dielectric, with copper circuitry on top. The metal core acts as an internal heat spreader, pulling heat away from hot components and distributing it efficiently into the chassis or heatsink.

    For products that must run cool, compact, and stable over long life, IMS is often the most direct upgrade from standard FR-4.

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