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    HomePCB PortfolioHigh Density Interconnect PCB

    High Density Interconnect PCB

    High-density interconnect, or HDI, circuit boards are printed circuit boards with a higher wiring density per unit area than traditional printed circuit boards. In general, HDI PCBs are defined as PCBs with one or all of the following: microvias; blind and buried vias; built-up laminations and high signal performance considerations. Printed circuit board technology has been evolving with changing technology that calls for smaller and faster products. HDI boards are more compact and have smaller vias, pads, copper traces and spaces. As a result, HDIs have denser wiring resulting in lighter weight, more compact, lower layer count PCBs. Rather than using a few PCBs in a device, one HDI board can house the functionality of the previous boards used.

     

    The primary benefit of HDI printed circuit boards is the capability to “do more with less”; with copper-etching technology continuously refined for better precision, it became possible to combine functionalities of multiple PCBs into one HDI PCB.

    FeatureTechnical specification
    Number of layers4 – 22 layers standard, 30 layers advanced
    Technology highlightsMultilayer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via holes and capture pads allowing microvias to only penetrate select layers and also be placed in surface pads.
    HDI builds1+N+1, 2+N+2, 3+N+3,4+N+4, any layer / ELIC, Ultra HDI in R&D
    MaterialsFR4 standard, FR4 high performance, Halogen free FR4, Rogers
    Copper weights (finished)18μm – 70μm
    Minimum track and gap0.075mm / 0.075mm
    PCB thickness0.40mm – 3.20mm
    Maxmimum dimensions610mm x 450mm; dependant upon laser drilling machine
    Surface finishes availableOSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers
    Minimum mechanical drill0.15mm
    Minimum laser drill0.10mm standard, 0.075mm advanced

    High Density Interconnect (HDI) PCBs are advanced printed circuit boards engineered for higher wiring density per unit area than conventional multilayer boards. By using laser-drilled microvias, fine-line imaging, and blind/buried via structures, HDI enables compact layouts, shorter signal paths, and better performance in high-speed and high-IO designs.

    At Benchuang Electronics in Shenzhen, HDI is one of our core production categories. We support projects from early prototype validation to stable mass production with a manufacturing system focused on microvia integrity, fine-line yield, and lamination registration.

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