Move beyond the limits of traditional HDI. Our SLP (Substrate-Like PCB) leverages mSAP technology to deliver $15/15\mu m$ precision, enabling a 30% reduction in board size for 5G, wearables, and SiP modules. From ISO Class 5 cleanrooms to IATF 16949-compliant mass production, we provide the technical certainty your next-gen hardware demands.
Benchuang’s SLP (Substrate-Like PCB) utilizes the mSAP (modified Semi-Additive Process) to achieve finer traces and higher reliability, mimicking the performance of an IC substrate on a larger board scale.
[1] REVOLUTIONARY mSAP PROCESS Unlike traditional subtractive etching, our mSAP process creates traces with vertical walls and precise geometries. This ensures superior impedance control and high signal integrity for high-frequency 5G applications.
[2] EXTREME SPACE OPTIMIZATION SLP reduces the area required for routing by 30-50% compared to Any-layer HDI. This frees up critical internal space for larger batteries, more sensors, or thinner device profiles.
[3] HIGH-DENSITY INTERCONNECTIVITY Supporting massive layer counts (up to 20 layers) with stacked microvias and ultra-thin cores. We enable the most complex AI and mobile chipsets to communicate with zero latency.
[4] AEROSPACE-GRADE RELIABILITY Based in Shenzhen, our facility integrates 19 years of experience serving Aerospace, Medical, and Automotive sectors, ensuring every SLP meets rigorous IPC Class 3 standards.
| Feature | Benchuang SLP Specification |
|---|---|
| Manufacturing Process | mSAP (modified Semi-Additive Process) |
| Min Line Width/Space | 25μm / 25μm (Target) |
| Layer Count | 4 - 20 Layers |
| Microvia Diameter | 50μm - 75μm |
| Surface Finish | ENIG / ENEPIG / Immersion Gold |
| Board Thickness | Ultra-thin (down to 0.4mm for 10 layers) |
