Language

Current Language
    Change Language
    HomePCB PortfolioIC Substrate PCBs

    IC Substrate PCBs

    IC Substrate is the chip that makes up the IC bare chip. It is the middle part of the chip package, providing support, heat sink, and protection for the chip, and providing electronic connection between the chip and the PCB. It is a key part in the packaging process, accounting for 35-55% of the packaging process cost.

     

    With the evolution of wafer process technology, the performance requirements for wafer wiring density, transmission rate, signal interference, etc. have increased, which has gradually increased the demand for IC packaging substrates.

     

    SUBFeature
    FC-CS2~6 layers
    Typical Line Width/Space12/12μm - 25μm/25μm
    WB-CSP2~6 layers
    Package Size33mm - 2323mm
    Thickness0.11mm - 0.56mm
    Typical Line Width/Space25/25μm - 40μm/40μm
    SiPCompatible with BGA, LGA, Flip Chip, Hybrid solutions
    Surface TreatmentSoft Au, ENEPIG, ENIG, SOP, OSP
    Heat dissipation performanceFine impedance line width control, excellent heat dissipation performance

    IC Substrate PCBs: Built for Advanced IC Packaging

    IC substrate PCBs (also called packaging substrates) are the high-density interconnect layer between the silicon die and the system PCB. They enable ultra-fine routing, microvia build-up, stable mechanical support, and controlled electrical/thermal performance for modern packages such as FC-BGA, BGA, CSP, and SiP.

    If your design is pushing I/O count, bump pitch, thickness, or high-speed performance, the substrate is the foundation that makes the package manufacturable and reliable.

    Free to contact us