Benchuang provides custom IC substrate PCB services. Our IC Substrate PCBs (ABF/BT Package Substrates) deliver ultra-high density interconnects and fine-line routing for advanced semiconductor packaging, supporting high I/O counts with build-up technology using ABF and BT resins to ensure superior thermal dissipation, signal integrity, and electrical performance in compact chip-scale designs. We achieve precise trace widths down to 0.015mm (15μm), impedance control (±10% tolerance), and robust surface finishes like ENIG or OSP for reliable flip-chip, wire-bonding, and fan-out applications.

We offer full turnkey PCBA services—including fabrication, SMT/BGA assembly, AOI inspection, and functional testing—for semiconductor packaging (CPU/GPU), consumer electronics (smartphones & wearables), data centers & AI accelerators, automotive (ADAS/ECUs), 5G infrastructure, medical devices, and computing hardware.