Our High-Density Interconnect PCBs (HDI PCBs) leverage laser-drilled microvias (down to 0.1mm), via-in-pad technology, and stacked/blind/buried vias to achieve ultra-high circuit density and miniaturization, with fine trace widths/spacing down to 50μm/50μm (2 mil) for compact, high-performance designs while ensuring superior signal integrity and thermal management in space-constrained applications.

We offer full turnkey PCBA services—including fabrication, SMT/BGA assembly, AOI inspection, and functional testing—for consumer electronics (smartphones & wearables), medical devices (portable monitors & imaging), telecommunications (5G modules), automotive (ADAS & ECUs), aerospace & defense, and data center hardware.