Engineered for most demanding thermal and power environments. Benchuang provides industry-leading Ceramic PCBs using Alumina (Al2O3) and Aluminum Nitride (AlN). We bridge the gap between extreme power and stable performance.
1-20 Layers Multilayer Capability
Up to 230 W/m.K Thermal Conductivity
7-15 Days Rapid Turnaround
19 Years of Manufacturing Excellence (Since 2007)
Engineered for most demanding thermal and power environments. Benchuang provides industry-leading Ceramic PCBs using Alumina (Al2O3) and Aluminum Nitride (AlN). We bridge the gap between extreme power and stable performance.
[1] UNMATCHED THERMAL MANAGEMENT Ceramic substrates offer heat dissipation 10-20x higher than traditional FR-4. Essential for high-power modules where heat is the enemy.
[2] PRECISION CTE MATCHING The Coefficient of Thermal Expansion (CTE) is perfectly tuned to silicon chips, preventing solder joint fatigue and ensuring long-term module stability.
[3] SUPERIOR DIELECTRIC PERFORMANCE Ultra-low dielectric constant and loss tangent. Ideal for 5G, RF, and High-Frequency signal integrity.
[4] EXTREME DURABILITY
| Specification | Range / Value |
|---|---|
| Substrate Materials | Alumina (Al2O3) / Aluminum Nitride (AlN) |
| Layer Count | 1 - 20 Layers |
| Thermal Conductivity | 24 ~ 230 W/m.K |
| Min Trace/Space | 0.05mm (2 mil) |
| Surface Finish | ENIG / OSP / Immersion Gold / Plated Gold |
| Technology | DPC / Thick Film / Thin Film |
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