High-Density Interconnect Solutions for Next-Generation Electronics

Executive Overview

As semiconductor nodes shrink to $3nm$ and below, the interface between the silicon and the motherboard becomes a critical bottleneck. Substrate-Like PCB (SLP) utilizes the modified Semi-Additive Process (mSAP) to deliver circuit densities previously reserved for IC substrates. This technology is mandatory for systems requiring ultra-fine pitch components and extreme thermal/signal stability.

I. Process Capabilities & Engineering Tolerances

Our SLP production lines are engineered to maintain structural integrity at the micron level, ensuring zero-defect performance in high-frequency environments.

II. Advanced Material Science & Signal Integrity

The shift to SLP is a response to the "Skin Effect" and dielectric loss in 5G/6G communication.

• Low-Loss Dielectrics: We utilize Modified PI (mPI) and Ajinomoto Buildup Film (ABF) equivalents to minimize signal attenuation above $28GHz$.
• Vertical Plating Uniformity: Our Vertical Continuous Plating (VCP) lines ensure copper thickness variance within $\pm 2\mu m$ across the entire panel, critical for high-speed differential pairs.
• Surface Finishing: ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) is our standard for SLP to support ultra-fine pitch gold wire bonding and prevent pad cratering.

III. Quality Assurance & Industrial Compliance

B-End reliability is verified through a rigorous multi-stage audit:

1. Automated Optical Inspection (AOI): High-resolution scanning to detect shorts, opens, and copper protrusions at $10\mu m$ resolution.
2. Thermal Stress Testing: 1,000 cycles from $-55^\circ C$ to $+125^\circ C$ to ensure via-to-trace interconnect reliability.
3. Cross-Sectional Analysis: Destructive physical analysis (DPA) on every production lot to verify inter-metallic layer thickness.
4. Certification: Full compliance with IATF 16949 (Automotive) and IPC-6012 Class 3 (High Reliability Electronics).

IV. Supply Chain Efficiency (B2B Logistics)

• DFM Feedback: Comprehensive Design for Manufacturing review within 24 hours of Gerber submission.
• Scalability: From NPI (New Product Introduction) samples to High-Volume Manufacturing (HVM) with a seamless process transfer.
• Traceability: Component-level barcode tracking for 100% material and process history.

V. Standardized RFQ Protocol

To ensure an accurate technical and financial proposal, please provide the following:

• Gerber Files: RS-274X or ODB++ format.
• Stack-up Detail: Specify dielectric thickness and target impedance values.
• Surface Finish: [ ] ENEPIG [ ] Immersion Silver [ ] Other.
• Volume Forecast: Prototype (units) vs. Annual Quantity (EAU).