Engineered for seamless system integration, our Module PCBs feature precision Half-Via (Castellated Hole) technology with a $\pm 0.05\text{mm}$ tolerance. Optimized for IoT and RF applications, our manufacturing process ensures burr-free edges and $\pm 5\%$ impedance control to maintain signal integrity across ultra-thin substrates. From ISO Class 5 cleanrooms to IATF 16949-certified mass production, we deliver the reliability required for high-yield SMT assembly.
[1] DUAL-FUNCTION INTEGRATION We master the art of integrating heavy copper traces (for power delivery) with fine-pitch HDI routing (for MCU/FPGA control). This reduces module size and eliminates interconnection bottlenecks.
[2] ADVANCED THERMAL MANAGEMENT Power modules generate heat. We utilize Thermal Vias, Metal Core (MCPCB) inserts, and high-Tg materials to ensure your control logic remains stable even under high-load thermal stress.
[3] SUPERIOR SIGNAL INTEGRITY Our high-density routing minimizes EMI (Electromagnetic Interference) between power switching circuits and sensitive control signals, ensuring zero-glitch performance in industrial environments.
[4] RUGGEDIZED FOR EXTREME CONDITIONS Built to withstand vibration, moisture, and temperature fluctuations. Our boards serve Aerospace, Medical, and Automotive sectors where failure is not an option.
| Feature | Benchuang Specification |
|---|---|
| Layer Count | 1 - 20 Layers |
| Copper Thickness | 0.5oz up to 6oz (Extreme Heavy Copper) |
| Base Materials | High-Tg FR4, Rogers, Polyimide, Ceramic |
| Trace/Space | Down to 0.075mm (3 mil) for Control Logic |
| Surface Finish | ENIG, ENEPIG, OSP, Hard Gold Plating |
| Testing Standards | IPC Class 2 & 3, 100% E-Test, AOI |
